Dishing and nitride erosion of STI-CMP for different integration schemes
Authors: Hwee, Lim; Balakumar, S.; Mahadevan, S.; Sheng, Zhou; See, Alex; Rahman, M.; Senthilkumar, A.
Source: Journal of Electronic Materials, Volume 30, Number 12, December 2001 , pp. 1478-1482(5)
Abstract:In this paper, we investigate the effects of integration schemes on the STI-CMP performance of two polishers, as well as the influence of consumables and process parameters. The experiment was based on both the blanket-oxide wafers and the patterned wafers processed using 0.18 m technology. The polishing capability was evaluated, based on the results collected using metrology tools such as Opti-probe, Tencor profiler; atomic force microscope (AFM), and x-ray-scanning electron microscopy (X-SEM) analysis.
Document Type: Research Article
Publication date: December 1, 2001