Effect of stress on the electrical resistivity of solder
Authors: Kim, Taejin; Chung, D.
Source: Journal of Electronic Materials, Volume 30, Number 10, October 2001 , pp. L29-L31(3)
Abstract:The electrical resistivity of tin-lead eutectic solder was found to increase upon tension. The effect was partially reversible. The fractional change in resistance per unit strain was 60. The irreversible part of the effect was due to plastic deformation.
Document Type: Research Article
Publication date: October 2001