Microstructure coarsening during static annealing of 60Sn40Pb solder joints: II eutectic coarsening kinetics

Authors: Jung, Kang; Conrad, Hans

Source: Journal of Electronic Materials, Volume 30, Number 10, October 2001 , pp. 1303-1307(5)

Publisher: Springer

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Abstract:

The eutectic coarsening kinetics for 60Sn40Pb solder joints annealed at 50°C to 150° C was determined to be of the form <Equation ID="E1"> <MediaObject> </MediaObject><EquationSource Format="TEX"><![CDATA[ $$bar D^n - bar D_o^n = K_o exp ( - Q/RT)t$$ ]]></EquationSource> </Equation>where <EquationSource Format="TEX"><![CDATA[ $$bar D$$ ]]></EquationSource> is the mean linear intercept phase size, <EquationSource Format="TEX"><![CDATA[ $$bar D_o approx 1.0$$ ]]></EquationSource> μm the as-reflowed phase size, n=4.1±0.15, Q=39.8±0.8 kJ/mole, K_o≍1×10⁻²³−4.5×10⁻²³ m⁴/s, and t the time. The magnitude of the phase size exponent, n, and the parameters, K_o and Q, are in accord with the models by Senkov and Myshlyaev and by Ardell for phase coarsening controlled by grain boundary or interfacial solute diffusion. The phase shape factor did not have a significant influence on the coarsening kinetics.

Keywords: Phase coarsening kinetics; activation energy; grain boundary diffusion

Document Type: Research article

DOI: http://dx.doi.org/10.1007/s11664-001-0115-y

Publication date: 2001-10-01