Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys

Authors: Wade, Noboru; Wu, Kepeng; Kunii, Johji; Yamada, Seiji; Miyahara, Kazuya

Source: Journal of Electronic Materials, Volume 30, Number 9, September 2001 , pp. 1228-1231(4)

Publisher: Springer

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Abstract:

The materials used in the present research are pure Sn metal and Sn-0.5% Cu, Sn-3.5%Ag, Sn-0.3%Sb, and Sn-3.5%Ag-0.5%Cu alloys. Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys have been investigated. Creep tests are performed at the stress and temperature range of 3 to 12 MPa and 378 to 403 K, respectively. A 3.5% addition of Ag had the largest contribution to the creep-rupture strength of Sn metal among the single addition of 0.5%Cu, 3.5%Ag, and 0.3%Sb. The combined addition of 3.5%Ag and 0.5%Cu makes the largest creep-rupture strength. The effects of these elements on the microstructure of the lead-free alloys are also investigated with optical microscope (OM) and transmission electron microscope (TEM) observations.
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