Kinetics of Au-containing ternary intermetallic redeposition at solder/UBM interface

Authors: Lee, Jong-Hyun; Park, Jong-Hwan; Shin, Dong-Hyuk; Lee, Yong-Ho; Kim, Yong-Seog

Source: Journal of Electronic Materials, Volume 30, Number 9, September 2001 , pp. 1138-1144(7)

Publisher: Springer

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Abstract:

In this study, the effects of the under bump metallurgy (UBM) structure and Cu content in solders on the redeposition rate of Au-containing ternary intermetallics at the solder/UBM interface were investigated. A UBM structure with a Ni diffusion barrier, Au/Ni/Cu, appeared to promote the redeposition of ternary Au-containing intermetallics at the solder/UBM interface of the ternary during the solid-state aging treatment and the Au-embrittlement of the solder interconnections. Copper added to the eutectic Sn-Pb and Sn-Ag solders was observed to be very effective in retarding the redeposition by forming the ternary intermetallics in solder matrices and preventing the Au-embrittlement. These phenomena were discussed with the microstructures observed.

Keywords: Au-containing ternary intermetallic; Au-embrittlement; aging treatment; fracture energy; redeposition

Document Type: Research Article

DOI: http://dx.doi.org/10.1007/s11664-001-0141-9

Publication date: September 1, 2001

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