Synthesis and characterization of porous polymeric low dielectric constant films
Authors: Xu, Yuhuan; Zheng, D.; Tsai, Yipin; Tu, K.; Zhao, Bin; Liu, Q.; Brongo, Maureen; Ong, Chung; Choy, Chung; Sheng, George; Tung, C.
Source: Journal of Electronic Materials, Volume 30, Number 4, April 2001 , pp. 309-313(5)
Abstract:This paper reports the synthesis and dielectric properties of a porous poly(arylether) material with an ultra-low dielectric constant for interlayer dielectric applications in microelectronics. The porous polymer films were successfully fabricated by a method of organic phase separation and evaporation. A dielectric constant k of 1.8 was achieved for a porous film with an estimated porosity of 40% and average pore size of 3 nm. Electrical and mechanical properties as well as coefficient of thermal expansion for both dense and porous polymer films were measured.
Document Type: Research article
Publication date: 2001-04-01