Journal of Electronic Materials

High conductivity copper-boron alloys obtained by low temperature annealing
pp. L1-L5(5)
Authors: Zhang, S.-L.; Harper, J.; D'Heurle, F.

Deposition of polycrystalline AIN thin films by coherent magnetron sputtering at temperatures <80°C
pp. 1-7(7)
Authors: Chu, A.; Chao, C.; Lee, F.; Huang, H.

Deposition of Polycrystalline AlN Thin Films by Coherent Magnetron Sputtering at Temperatures <80°C
pp. 1-5(5)
Authors: A.K. Chu; C.H. Chao; F.Z. Lee; H.L. Huang

Up-Conversion Luminescence of Erbium (III) Oxalate Nanoparticles/Titania/ÿ-Glycidoxypropyltrimethoxysilane Composite Sol-Gel Thin Films
pp. 6-10(5)
Authors: Wenxiu Que; Y. Zhou; Y.L. Lam; Y.C. Chan; C.H. Kam; L.H. Gan; G. Roshan Deen

Up-conversion luminescence of erbium (III) oxalate nanoparticles/titania/ÿ-glycidoxypropyltrimethoxysilane composite sol-gel thin films
pp. 7-10(4)
Authors: Que, Wenxiu; Zhou, Y.; Lam, Y.L.; Chan, Y.; Kam, C.; Gan, L.; Roshan Deen, G.

Simulation of microstructural evolution induced by scanned laser annealing of metallic interconnects
pp. 11-16(6)
Authors: Hau-Riege, C.; Hau-Riege, S.; Thompson, C.

Simulation of Microstructural Evolution Induced by Scanned Laser Annealing of Metallic Interconnects
pp. 11-16(6)
Authors: C.S. Hau-Riege; S.P. Hau-Riege; C.V. Thompson

Solid phase reaction of Ti with Si−Ge layers prepared by Ge-implantation
pp. 17-22(6)
Authors: Umapathi, B.; Das, S.; Lahiri, S.; Kal, S.

Solid Phase Reaction of Ti with Si-Ge Layers Prepared by Ge-Implantation
pp. 17-22(6)
Authors: B. Umapathi; S. Das; S.K. Lahiri; S. Kal

Properties of GaN epitaxial layers grown at high growth rates by metalorganic chemical vapor deposition
pp. 23-26(4)
Authors: Kokubun, Y.; Nishio, J.; Abe, M.; Ehara, T.; Nakagomi, S.

Properties of GaN Epitaxial Layers Grown at High Growth Rates by Metalorganic Chemical Vapor Deposition
pp. 23-26(4)
Authors: Y. Kokubun; J. Nishio; M. Abe; T. Ehara; S. Nakagomi

The effects of process conditions and substrate on copper MOCVD using liquid injection of (hfac)Cu(vtmos)
pp. 27-34(8)
Authors: Jun, Chi-Hoon; Kim, Youn

The Effects of Process Conditions and Substrate on Copper MOCVD Using Liquid Injection of (hfac)Cu(vtmos)
pp. 27-34(8)
Authors: Chi-Hoon Jun; Youn Tae Kim

Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems
pp. 35-44(10)
Authors: Zeng, K.; Kivilahti, J.

Use of Multicomponent Phase Diagrams for Predicting Phase Evolution in Solder/Conductor Systems
pp. 35-44(10)
Authors: K. Zeng; J.K. Kivilahti

The effect of Pb contamination on the solidification behavior of Sn-Bi solders
pp. 45-52(8)
Authors: Moon, Kil-Won; Boettinger, William; Kattner, Ursula; Handwerker, Carol; Lee, Doh-Jae

The Effect of Pb Contamination on the Solidification Behavior of Sn-Bi Solders
pp. 45-52(8)
Authors: Kil-Won Moon; William J. Boettinger; Ursula R. Kattner; Carol A. Handwerker; Doh-Jae Lee

Effects of impurities on removal of polysilicon in chemical-mechanical polish
pp. 53-58(6)
Authors: Liu, Don-Gey; Tsai, Ming; Yang, Wen; Cheng, Chih-Yuan

Effects of Impurities on Removal of Polysilicon in Chemical-Mechanical Polish
pp. 53-58(6)
Authors: Don-Gey Liu; Ming-Shih Tsai; Wen Luh Yang; Chih-Yuan Cheng

High Conductivity Copper-Boron Alloys Obtained by Low Temperature Annealing
pp. 59-61(3)
Authors: S.-L. Zhang; J.M.E. Harper; F.M. d'Heurle