Copper metallizations for integrated circuits: tem analysis and electrical characterization
Authors: Bruschi, P.; Ciofi, C.; Dattilo, V.; Diligenti, A.; Nannini, A.; Neri, B.
Source: Journal of Electronic Materials, Volume 26, Number 8, August 1997 , pp. L17-L20(4)
Abstract:Copper thin films have been deposited by means of three different techniques. Transmission electron microscopy analysis and electrical characterization revealed that the three types of film had different average grain size and resistivity. The two different contributions to the total resistivity, due to the scattering at the grain boundaries and at the intragranular defects, have been separated by using the Mayadas-Shatzkes theory. Microstructural analysis, electrical characterization, noise measurements, and lifetime tests have been performed in order to identify the deposition technique which leads to the most reliable interconnection lines.
Document Type: Research Article
Publication date: August 1997