Robustness evaluation using highly accelerated life testing

Authors: Charki, Abdérafi1; Laronde, R.2; Guérin, F.2; Bigaud, D.2; Coadou, F.2

Source: The International Journal of Advanced Manufacturing Technology, Volume 56, Numbers 9-12, October 2011 , pp. 1253-1261(9)

Publisher: Springer

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Abstract:

This paper presents experimental aspects and results of highly accelerated life testing in order to study the robustness of electronic boards subject to two main covariates: thermal and vibration stresses. Statistical analysis of test results and assessment of the product quality characteristics under different conditions (operating and destruction limits) are presented. Recommendations for further testing are also presented.

Keywords: Accelerated testing; Reliability; Robustness

Document Type: Research Article

DOI: http://dx.doi.org/10.1007/s00170-011-3264-z

Affiliations: 1: LASQUO, ISTIA–University of Angers, 62 av. Notre Dame du Lac, 49000, Angers, France, Email: abderafi.charki@univ-angers.fr 2: LASQUO, ISTIA–University of Angers, 62 av. Notre Dame du Lac, 49000, Angers, France

Publication date: October 1, 2011

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