Experimental and numerical analysis of titanium/aluminum clad metal sheets in sheet hydroforming
Authors: Tseng, Huang-Chi1; Hung, Jung-Chung2; Hung, Chinghua3; Lee, Ming-Fu4
Source: The International Journal of Advanced Manufacturing Technology, Volume 54, Numbers 1-4, April 2011 , pp. 93-111(19)
Publisher: Springer
Abstract:
Clad metals are becoming increasingly emphasized in sheet metal applications. In this research, sheet hydroforming process (SHF) was adopted to improve the formability of Ti/Al clad metal sheets and SUS 304 metal sheets used in computer, communication, and consumer product housings. Both finite element simulation and experimental verification were carried out to investigate the deformation of blanks. Several significant process parameters, such as holding force, friction, counter pressure history, and blank dimensions, were discussed for improving the formability of the two metal sheets. In SHF simulation, a virtual film technique was proposed to realistically approach the hydraulic loading condition during SHF. Finally, the deformed shape and thickness distribution of parts manufactured with SHF were compared with the results of simulation. Good agreements were obtained.Keywords: Clad metal; Sheet hydroforming; 3C product housing; FE simulation
Document Type: Research article
DOI: http://dx.doi.org/10.1007/s00170-010-2911-0
Affiliations: 1: Department of Mechanical Engineering, National Chiao Tung University, Hsinchu, 30050, Taiwan, Republic of China 2: Department of Mechanical Engineering, National Chin-Yi University of Technology, Taiping City, 411, Taiwan, Republic of China 3: Department of Mechanical Engineering, National Chiao Tung University, Hsinchu, 30050, Taiwan, Republic of China, Email: chhung@mail.nctu.edu.tw 4: Metal Industries Research & Development Centre, Kaohsiung, Taiwan, Republic of China
Publication date: 2011-04-01
- In this: publication
- By this: publisher
- In this Subject: Materials & Manufacturing , Technology
- By this author: Tseng, Huang-Chi ; Hung, Jung-Chung ; Hung, Chinghua ; Lee, Ming-Fu

Shopping cart
Receive new issue alert