Authors: Kim H-J.¹; Rafailovich M.²; Sokolov J.²

Source: Polymer International, Volume 53, Number 3, March 2004 , pp. 287-293(7)

Publisher: John Wiley & Sons, Ltd.

Abstract:

This study examines the interfacial adhesion between poly(styrene) (PS) and poly(styrene-co-acrylonitrile) (SAN) interfaces reinforced with poly(styrene-co-vinyl phenol) (PS-ran-PSPh) random copolymers using an asymmetric double-cantilever beam (ADCB) test. The effects of oligomer and copolymer composition on interfacial adhesion were investigated. The results showed that the interfacial adhesion of the PS/SAN interface was increased significantly after removing the residual oligomer from the SAN. The interfacial adhesion was also measured for five-purified SAN materials in the range 17–31 wt%. The highest level of PS/SAN adhesion was observed for 17% AN (acrylonitrile) materials. In addition, the interfacial adhesion of a mixture of diblock and random copolymer was measured in order to investigate which is the most effective method. The results showed that mixture systems are more cost-effective with higher adhesion, which is independent of temperature. Atomic force microscopy showed that a single craze ahead of the crack is a possible failure mode during PS/SAN interface fracture. Copyright © 2004 Society of Chemical Industry

Keywords: interfacial adhesion; oligomer; interfacial layer; random copolymer; block copolymer; immiscible polymer joints

Document Type: Research article

DOI: http://dx.doi.org/10.1002/pi.1367

Affiliations: 1: Laboratory of Adhesion and Bio-Composites, Department of Forest Products, Seoul National University, Seoul 151-742, South Korea 2: NSF-MRSECs, Garcia Center for Polymers at Engineered Interfaces, Department of Materials Science and Engineering, State University of New York at Stony Brook, New York 11794-2275, USA

Publication date: 2004-03-01

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