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Publisher: John Wiley & Sons, Ltd. on behalf of the Society of Chemical Industry

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Volume 50, Number 7, 1 July 2001

Editorial
pp. 741-741(1)
Author: Toureille, A.

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Influence of heat treatment on the space charge within an epoxy resin polymer material
pp. 743-747(5)
Authors: Guermazi, H.; Smaoui, H.; Agnel, S.; Mlik, Y.; Toureille, A.; Schué, F.

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Elasticity of hexagonal liquid crystals
pp. 778-783(6)
Authors: Derbel, N.; Raïs, K.; Tounsi, N.; Othman, T.; Gharbia, M.; Gharbi, A.; Nguyen, H.T.; Malthête, J.

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Relation between microstructure and glass transition temperature of poly[(methyl methacrylate)-co-(ethyl acrylate)]
pp. 784-791(8)
Authors: Nguyen, G.; Nicole, D.; Matlengiewicz, M.; Roizard, D.; Henzel, N.

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Modelling of resol resin polymerization with various formaldehyde/phenol molar ratios
pp. 796-802(7)
Authors: Manfredi, L.B.; Riccardi, C.C.; Osa, O.d.l.; Vázquez, A.

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Influence of temperature on lattice spacings of melt-crystallized poly(iminosebacoyl iminodecamethylene)
pp. 817-821(5)
Authors: Yang, X.; Kong, X.; Tan, S.; Li, G.; Zhou, E.

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Lead–yeast hexokinase interaction: modifications to protein structure caused by the metal
pp. 822-827(6)
Authors: Teijón, C.; Olmo, R.; Socorro, J.M.; Blanco, M.D.; Romero, A.; Teijón, J.M.

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