Skip to main content

The Engineering Entrepreneurship Survey: An Assessment Instrument to Examine Engineering Student Involvement in Entrepreneurship Education

Buy Article:

$38.00 plus tax (Refund Policy)

Abstract:

This paper describes the Engineering Entrepreneurship Survey (EES), an assessment instrument designed to examine engineering student involvement in entrepreneurship education and related outcomes. It was developed as part of an NSF-funded study "Entrepreneurship Education and its Impact on Engineering Student Outcomes: The Role of Program Characteristics and Faculty Beliefs." It has been used successfully over the past two years to gather data from senior-level students at multiple institutions that have entrepreneurship courses or programs that are available to engineers. The 135-item survey examines: 1) engineering student attitudes towards entrepreneurship, 2) engagement in entrepreneurial activities and behaviors, 3) knowledge of entrepreneurship-related terms and concepts, 4) entrepreneurial self-efficacy, 5) student perceptions of engineering faculty attitudes toward entrepreneurship. Item categories and subscales show high reliability. The validated survey collects baseline data that can be valuable in program development and evaluation.

Document Type: Research Article

Publication date: 2011-12-01

More about this publication?
  • The Journal of Engineering Entrepreneurship, a peer-reviewed, international journal. The primary source for an intellectual dialog between engineering entrepreneurship educators, researchers, and practitioners.
  • Editorial Board
  • Ingenta Connect is not responsible for the content or availability of external websites
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more