Skip to main content

A new procedure for quantification of lignin in soybean (Glycine max (L.) Merrill) seed coat and their relationship with the resistance to mechanical damage

Buy Article:

$38.00 plus tax (Refund Policy)


The quantitative assay for protein-free lignin measured by thioglycolic acid reaction was applied to soybean (Glycine max L.) seed coat. The lignothioglycolic acid (LTGA) produced by the reaction of thioglycolic and lignin was recorded (at A280 nm) for various dilutions and a wavelength - dependent absorptivity value (ε = 17.87 g−1 L cm−1) was obtained. Subsequently, the lignin contents of eleven soybean cultivars (Savana, Davis, FT-10, Paranagoina, Bossier, IAC-8, Santa Rosa, Doko, ParanĂ¡, FT-2 and IAS-5) were determined. The lignin contents correlated with the index of resistance to seed mechanical damage. These results indicate that the LTGA method for lignin quantification can be used for screening genotypes for mechanical damage resistance in a breeding program for soybean seed quality.

Document Type: Research Article


Publication date: July 1, 2005

More about this publication?
  • Seed Science and Technology (SST) is one of the leading international journals featuring original papers and review articles on seed quality and physiology as related to seed production, harvest, processing, sampling, storage, distribution and testing. This widely recognised journal is designed to meet the needs of researchers, advisers and all those involved in the improvement and technical control of seed quality.
  • Editorial Board
  • Information for Authors
  • Subscribe to this Title
  • Membership Information
  • Ingenta Connect is not responsible for the content or availability of external websites

Access Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content
Cookie Policy
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more