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Photonic Sintering of Inkjet Printed Copper Oxide Layer

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Abstract:

Recently, printing technologies have been adapted for the manufacturing of flexible electronic devices such as RFID antennas, capacitors, rectifiers, organic thin film transistors, photovoltaics, etc. In contrast to traditional production of electronics, printing technologies can enable low cost, high throughput, and large-area processing on flexible polymer materials. Photolithographical processes can be substituted by direct printing, e.g. of metal nanoparticles (NPs) or organic inks on flexible polymer foils. After the deposition of the materials by printing, curing, drying and/or sintering is required to remove solvents and additives, and to develop a functional layer. The operating temperatures of these post-printing processes are usually higher than the tolerable temperature of the polymer foils, which results in plastic thermal deformations of the foils. Photonic sintering is considered as one of the promising technology, especially for R2R processing, to prevent the thermal deformation of the substrate. It allows processing in ambient conditions without damaging the polymer foils due to energy exposure in microseconds-scale.

In this paper, the effect of photonic sintering conditions on inkjet printed copper oxide (CuO) layers was investigated. We found that the conductivity is proportional to the exposure energy. However, excessive energy will lead to “over-sintering” and thus destroys the copper layer. Optimized photonic sintering parameters were proposed to obtain inkjet-printed copper layers with high conductivity and no layer ablation.

Document Type: Research Article

Publication date: 2013-01-01

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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