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VOC Elimination in Printers by Means of Thermally Activated Oxide Semiconductors (TASC)

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Abstract:

VOCs (volatile organic compounds) arising from fusers in printers, solvent inks in inkjet printers, or wet POD systems cause environmental problems at present. Therefore, efficient elimination technologies are in high demand. We will introduce our novel VOC elimination system utilizing thermally activated semiconductors (TASC). The TASC technology is characterized by the use of highly oxidative holes generated by thermal excitation of semiconductors. As is well known, the number of electrons and holes can be created in accordance with an exponential function of temperature according to the semiconductor theory. This clearly indicates the formation of a vast number of charge carriers when heated at about 350-500 °C. The first process of the decomposition reaction is the capture of bonded electrons (i.e. oxidation) from VOC molecules, even polymers, leaving behind free radicals. The free radical is unstable and can propagate throughout the molecule at 350-500 °C. This makes the whole molecule unstable and induces a radical splitting resulting in the fragmentation of the molecule. The fragmented molecules then react with oxygen in air to completely burn to give rise to H2O and CO2. Our system is simple, small and low cost, and thus can easily be integrated into office printers or wet POD systems.

Document Type: Research Article

Publication date: 2013-01-01

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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