Inkjetprinting of Vertically Integrated RC-Circuits
To model the electric behavior of the RC-circuits, both the capacitors' and resistors' behavior is compared to non-integrated devices of the same size and shape. Based on these results, it is shown how existing single-device models can be applied to integrated devices.
To improve the sintering process, furthermore the impact of heat on the behavior of the used organic additives is examined. The solid additives have to burn thoroughly. It is analyzed whether there is a liquid phase during sintering and how this may affect the resulting structure.
Document Type: Research Article
Publication date: 2013-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.
- Information for Authors
- Submit a Paper
- Subscribe to this Title
- Membership Information
- Terms & Conditions
- Ingenta Connect is not responsible for the content or availability of external websites