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Drying Technology Using Laser Exposure for High-speed Inkjet Printing

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Abstract:

To ensure reliability with high-speed inkjet printing devices that print at 200 m/min using water-based ink, it is important for ink to penetrate and dry at high speeds. With current drying devices that use heating drums, heat is applied to the entire surface of the paper from the back side of the printed surface. Since it is not possible to avoid the rise in temperature to portions of the paper where ink is not applied, differences in the amount of paper deformation occur between printed areas where expansion/cockling occurs due to water and non-printed areas of the paper that shrink. As a result, this causes creases to the paper. To avoid this problem, the authors examined the use of infrared laser exposure for drying. With laser exposure, ink is directly heated and strong drying energy can be applied instantaneously, enabling for only the ink to be dried and for drying to occur in nearly the same time span as ink penetration. As a result, an increase in the temperature of the non-printed areas is prevented, and deformation of the paper is controlled no matter the amount of ink applied; by controlling ink penetration, feathering/linebleeding is reduced and image quality is improved.

Document Type: Research Article

Publication date: 2013-01-01

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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