Copper Ink-Jet inks for Flexible and Plastic Electronics
Abstract:One of the greatest challenges in fabrication of flexible and plastic electronics devices by printing is to obtain highly conductive patterns at sufficiently low temperatures which will not damage the heat sensitive substrates. Therefore, during the last decade, several approaches for the sintering of metallic nanoaprticles (NPs), usually silver, at low temperatures, were developed. However, the high cost of these silver based nano-inks limits fabrication of low cost plastic devices. Therefore, there is an unmet need for a low cost metallic ink with a low sintering temperature.
Here we describe the formation and printing of copper based ink-jet inks. Tailoring the nanoparticles stabilization mechanism enabled the formation of a low sintering temperature ink. It is shown that the use of these ink enables the formation of various devises printed on plastic, for example, copper based electroluminescent device and RFID antennas. Furthermore, the presence of anti-oxidation agents enables to achieve highly conductive patterns stable in air for a long time.
Document Type: Research Article
Publication date: January 1, 2012
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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