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Feasibility Study: Inkjet Filling of Through Silicon Vias (TSV)

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Three-dimensional stacking and integration (incl. Through Silicon Vias - TSV) of microelectronic devices are modern techniques with great potential in industrial application, but face severe cost-disadvantages. In this paper, a new filling technique for TSV based on inkjet printing with a high cost-saving potential is proposed. We give a brief explanation of this new technique and present first results of processed samples.

Our TSV processing technique can be summarized in three major steps. In step one, multiple structures are pre-etched in standard silicon wafers. These structures require an electrical isolation from the surrounding substrate. In step two, a standard piezoelectric inkjet nozzle is used to print our self-developed silver ink into these structures, forming the vias. After the ink is dried, in the third and final step, the samples are sintered. Finally the TSV samples are analyzed by cross sectional polishing and a scanning electron microscope.

This paper proves the feasibility of inkjet printing of TSVs by homogeneous covering of via side walls with silver particles.
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Document Type: Research Article

Publication date: 2012-01-01

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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