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Feasibility Study: Inkjet Filling of Through Silicon Vias (TSV)

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Three-dimensional stacking and integration (incl. Through Silicon Vias - TSV) of microelectronic devices are modern techniques with great potential in industrial application, but face severe cost-disadvantages. In this paper, a new filling technique for TSV based on inkjet printing with a high cost-saving potential is proposed. We give a brief explanation of this new technique and present first results of processed samples.

Our TSV processing technique can be summarized in three major steps. In step one, multiple structures are pre-etched in standard silicon wafers. These structures require an electrical isolation from the surrounding substrate. In step two, a standard piezoelectric inkjet nozzle is used to print our self-developed silver ink into these structures, forming the vias. After the ink is dried, in the third and final step, the samples are sintered. Finally the TSV samples are analyzed by cross sectional polishing and a scanning electron microscope.

This paper proves the feasibility of inkjet printing of TSVs by homogeneous covering of via side walls with silver particles.

Document Type: Research Article

Publication date: January 1, 2012

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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