Feasibility Study: Inkjet Filling of Through Silicon Vias (TSV)
Our TSV processing technique can be summarized in three major steps. In step one, multiple structures are pre-etched in standard silicon wafers. These structures require an electrical isolation from the surrounding substrate. In step two, a standard piezoelectric inkjet nozzle is used to print our self-developed silver ink into these structures, forming the vias. After the ink is dried, in the third and final step, the samples are sintered. Finally the TSV samples are analyzed by cross sectional polishing and a scanning electron microscope.
This paper proves the feasibility of inkjet printing of TSVs by homogeneous covering of via side walls with silver particles.
Document Type: Research Article
Publication date: 2012-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
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