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Low-cost Ink-Jet printing for Electrical Functionalization of Rigid Substrate Materials

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Digital printing processes are gaining more and more interest as an approach to implement electrical functionality (conductive patterns, sensors etc.) on different types of substrate materials. Focusing on the inkjet-printing process, the paper presents results that were gathered with-in the research project “FKIA”, funded by the Bavarian Research Foundation. In the paper, the applicability of inkjet printing of silver nanoparticle ink on technical thermoplastics substrate materials commonly used in automotive applications such as glass fiber filled PA, but also on phenolic paper substrates (FR-2) is investigated. In this context, the influence of the surface roughness of the molding tool on the printing results was examined. Besides thermal sintering of nanoparticles, photonic sintering as one alternative approach is discussed. In addition, the long-term behavior of the produced conductor tracks was investigated. Parts were exposed to thermal cycling between −20°C and +100° for 1500 cycles. Besides the stability of the electrical properties also the mechanical stability of the metallic layers on the different substrates was compared with the findings prior to any exposure.

Document Type: Research Article

Publication date: January 1, 2012

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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