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Dielectric Properties Study of Thin Polymer Film Layers Used in LEP

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Indigo's technology is based on Liquid Electro Photography (LEP). In this process an electrostatic latent image is first produced on the Photo Imaging Plate (PIP) and then ink is transferred to PIP. Afterward the ink is transferred to the intermediate transfer media, i.e. blanket and finally to the printing media (substrate). The electro ink is transferred mainly due to electrical fields (forces). In this process different types of polymeric coatings are used on the intermediate transfer media (blanket) and the electrical ink transfer depends strongly on these polymers electrical properties. In this work we present a technique for measuring electrical properties of different types of polymeric material coatings at different conditions. This unique set-up enables working under a wide range of physical parameters: temperatures, pressures, electrical voltages and frequencies. A theoretical study of the impedance behavior and equivalent electrical circle has been developed. The analysis shows good matching between experimental and theoretical results. This technique allows better understanding of development of new polymeric materials and determining process working points, especially temperature and electrical voltages.

Document Type: Research Article

Publication date: 2012-01-01

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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