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Metal Oxide Transistors with Good Substrate Latitude

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When considering “printed electronics,” the substrates of interest can vary from smooth glass to flexible polymeric supports, and even to rough paper. Relatively few standard semiconductor processes adapt readily to a wide variety of substrates. We will discuss an approach to thin-film electronics that uses the conformality of atomic layer deposition to produce good-quality metal oxide thin-film transistors on a wide variety of substrates.

Deposition of the active materials is by an atmospheric pressure, roll-compatible process called spatial atomic layer deposition (SALD), and the materials deposited are metal oxides. Electrical properties of SALD-grown planar thin-film transistors include mobility above 20 cm2/V-s, high on/off ratios, and good uniformity of the deposited layers.

In addition to depositing good-quality thin-film transistor layers at temperatures of 200 °C, this process allows for decent transistors at temperatures down to 100 °C, thus opening up the range of usable substrates.

A novel vertical transistor geometry that exploits the conformal nature of the SALD deposition system will also be introduced. This device architecture shows good electrical properties and could provide a promising approach for both rigid and flexible substrates.
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Document Type: Research Article

Publication date: 01 January 2011

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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