3D RFID Transponder Antennas for Smart Packaging Applications
Abstract:During the recent years we observe a growing number of smart packaging applications. Within this field radio frequency identification (RFID) technology contributes remarkably to the progress by providing the matching communication / data transmission opportunities. In order to employ RFID technology for packaging applications the availability of highly functional RFID transponders (antenna + silicon chip) is necessary, which satisfy a maximum of communication reliability and reading distance. We report on a significant improvement of the performance of existing transponder systems by the introduction of three dimensional (3D) antennas which can be printed cost efficient directly on the planar packaging material and become three dimensional in the folding step of erecting a cardboard box. These 3D antennas for different frequency ranges, each particularly designed regarding layout and dimensions of the package and its content open a wide range of reliable packaging applications and therefore contribute remarkably to the development of the “internet of things”.
Document Type: Research Article
Publication date: 2011-01-01
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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