Inkjet Printing of Electrical Connections in Electronic Packaging
Abstract:Two aspects were evaluated of an approach to produce inkjet printed electrical connections in a roll-to-roll application. In the first part it was demonstrated that inkjet printing with silver nanoparticles allows to connect LED dies embedded in a flexible polymeric substrate by way of electrical via connections and to operate the LED dies at their nominal 20 mA and 3 V driving conditions. A standard convection oven process was used to sinter the inkjet printed tracks. The second part of the work focused on identifying sinter technologies that provide the required fast processing times needed for roll-to-roll applications. IR irradiation, Rapid Electrical Sintering, and Broadband Photonic Curing were evaluated and compared with Convective Oven Sintering as benchmark technique. All these techniques produced similar track conductivities. Fastest operation was obtained with Broadband Photonic Curing, which enabled a total process time of three seconds as compared with 150 °C and 30 min in the convection oven.
Document Type: Research Article
Publication date: 2011-01-01
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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