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Development of Power Saving Thermal Print Head Part 2

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Power saving of Thermal Print Head was studied.

Since heat characteristics and thickness of head substrate are effective on power saving, as reported in NIP25, low thermal diffusivity glass have been developed.

FEM simulation was adopted to estimate the characteristics of Thermal Print Head efficiently.

Phosphate composition which satisfies the requirement on Thermal Print Head such as homogeneity, 650 Deg C or higher Tg and climate resistance was found. Thermal diffusivity 0.33mm2/sec was achieved.

Sample Thermal Head was made with substrate thickness calculated from simulation to satisfy both power saving and print quality.

The test result of Thermal Head sample showed 25% power saving and sufficient print quality.
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Document Type: Research Article

Publication date: 2010-01-01

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  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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