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Development of Power Saving Thermal Print Head Part 2

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Power saving of Thermal Print Head was studied.

Since heat characteristics and thickness of head substrate are effective on power saving, as reported in NIP25, low thermal diffusivity glass have been developed.

FEM simulation was adopted to estimate the characteristics of Thermal Print Head efficiently.

Phosphate composition which satisfies the requirement on Thermal Print Head such as homogeneity, 650 Deg C or higher Tg and climate resistance was found. Thermal diffusivity 0.33mm2/sec was achieved.

Sample Thermal Head was made with substrate thickness calculated from simulation to satisfy both power saving and print quality.

The test result of Thermal Head sample showed 25% power saving and sufficient print quality.

Document Type: Research Article

Publication date: January 1, 2010

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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