Development of New Multi-Purpose Heating Head

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Abstract:

We developed a new multi-purpose heating head. It resembles the traditional thermal printhead which has the resistive heating element on the ceramic substrate. Some differences are that it has a continuous resistive element while the printhead has an array of individual independent resistive element heating dots. Consequently, the methods to energize two devices are different. The most significant difference is that it has the heating element on the back side of the ceramic substrate and the media contact is on the front side of the substrate. This unique structure solves many problems which have been difficult and costly to deal with in the traditional structure. Heating element abrasion is no longer a problem as the media is not in contact with the heating element side. The heating element protective over-coating layer is not needed. Other benefits are the even temperature distribution throughout the heating head and easiness of manipulating the heating characteristics of the heating element. A family of heating heads using this idea has been made from small to large format. The new concept product is suitable for thermal rewritable printer erase head, thermal re-transfer printer heating head, pre/post-printing process of printing media and electrophotographic printer toner fuser.

Document Type: Research Article

Publication date: January 1, 2010

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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