The Use of Inkjet in Packaging Applications
Abstract:There are several unique features in inkjet, which makes it almost the perfect printing method. For example, it is the only contactless printing method, so any substrate – flexible, rigid or fragile – can be printed. It is also an additive method, which means that multilayer structures or even 3D objects can be built, so many new applications for example in the areas of bio- and nanotechnology, decorative and fabrics printing, electronics, mechanical devices and combinatorial chemistry have been researched during last years.
In the area of conventional printing, inkjet is also gaining ground rapidly in the application areas like wide format graphics, direct mailing, textile printing and high quality publishing. One of the most potential areas for inkjet is the packaging applications.
In the packaging sector, inkjet has traditionally been used in the coding and marking applications. The lack of adequate print quality has prevented its use in the consumer packages, but now the situation is rapidly changing. This is due to the very fast development of inkjet printing head and ink technologies. VTT has actively been dealing with inkjet packaging projects for more than twelve years. In this article, findings of VTT's packaging research projects have been presented.
Document Type: Research Article
Publication date: January 1, 2010
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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