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Adhesion in LEP and its Correlation to Paper Surface Chemical Makeup

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In digital printing, adhesion of marking materials, such as ink, to a substrate, such as paper or plastic, is of paramount importance. In Liquid Electrophotographic Printing (LEP), the adhesion is even more critical as the typical LEP process does not involve any post-printing fixing step. In an earlier publication, we have shown that acid-base and van-der Waals interactions at the ink-paper interface determine the adhesion in LEP. In this paper, we attempt to correlate such interactions to paper surface components which contribute to both good and bad adhesional characteristics. We have selected four representative commercially available papers and isolated their coating materials. These coating materials were dissolved in non-polar and polar solvents, such as chloroform, toluene and water, and then analyzed using FTIR spectroscopic measurements, proton NMR and LCMS analyses. Our results indicate presence of styrene butadiene rubber in most coated papers with different amounts of butadiene to styrene (B toS) ratios. We found that generally 1:1 to 1:1.2 B to S ratios were better performers while B to S of 1:2 to 1:2.5 were poorer performers. We also found that papers with some amounts of poly vinyl alcohol or starch as co-binders of the media coating showed good adhesion. Uncoated papers with carboxylic acid also showed good adhesion.

Document Type: Research Article

Publication date: January 1, 2010

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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