Thermal Performance of Copy Papers During Fusing
An analysis of heat and moisture transport within the sheets subjected to a rapid thermal pulse was conducted. A mathematical model was developed using the equations of transient energy and moisture transport. The model equations were solved using the finite element method to predict temperature and moisture content profiles and their evolution within the paper sheets. Thermal conductivity, heat capacity and moisture diffusivity of copy paper sheets were measured in the laboratory and used as inputs to the mathematical model to predict the temperature and moisture response in the fusing section.
Excellent agreement was found between the model predictions and experimental temperature and moisture contents for several paper sheets under different conditions. The thermal conductivity and heat capacity are the critical parameters determining the temperature and moisture profiles and were strongly dependent on sheet structure.
Document Type: Research Article
Publication date: 2010-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
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