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Multi-Level Simulation of Digital PSPs

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As Print Service Providers (PSPs) become more digital and move toward digital presses and digital workflows, a technique from Electronic Design Automation called multi-level simulation can simultaneous analyze and recreate interplay of operations, document design, and lean manufacturing with the next generation of PSPs. Multi-level simulation recognizes that hierarchical design has different levels of abstraction and each layer of abstraction has its own design language to search its respective design space. However, multi-level simulation integrates these multiple heterogeneous and overlapping layers of design abstraction for an optimal system goal. This goal for silicon chip is power, clock speed, or die size; the goal for a digital PSP is, ultimately, operational efficiency in the face of variability of job fulfillment. Multi-level simulation of a PSP bind together the competing goals of manufacturing efficiency, operational overhead, and content fulfillment capabilities; we submit there are three abstraction layers for these PSP goals: job for routing both inter-PSP and intra-PSP, PDL transformations for workflow, and image for visual inspection. Using Ptolemy EDA tools as a backbone, we will demonstrate this approach on such complex, high-value digital workflows such as security documents and automated print quality analysis, in terms of higher operational efficiency and profit per pages.

Document Type: Research Article

Publication date: January 1, 2010

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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