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Development of Ultra Clean Photoresist for MEMs Device Applications

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Manufacturers of permanent photoresist consider an array of functional requirements when developing new materials. Each step, from synthesis through formulation and film processing, impacts the quality and reliability of the finished product. Typically, pattern-cured formulations consist of functionally different source materials which are employed to match pre-set goals for optical, mechanical, thermal and electrical film properties. However, source materials may contribute ionic and other impurities, either resulting from their respective synthesis, or generated as processing by-products. These impurities can pose a corrosion risk following migration to susceptible metal surfaces with which the film is in contact.

The goal of this work is to identify and understand corrosion risks presented by mobile ion impurities as a function of bulk film thermo-mechanical properties. For permanent films used in inkjet applications, key material properties include glass transition temperature (Tg), modulus and water permeability. Electrochemical Impedance Spectroscopy (EIS) was used along with Dynamic Mechanical Analysis (DMA), to characterize prototype films. The level of corrosive species present was analytically quantified via Inductively Coupled Plasma Mass Spectrometry (ICP-MS). Our data shows that thermo-mechanical properties of fully cured permanent film have significant impact on preventing corrosion with significant amounts of corrosive species present.
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Document Type: Research Article

Publication date: 01 January 2010

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  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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