Development of Ultra Clean Photoresist for MEMs Device Applications
Abstract:Manufacturers of permanent photoresist consider an array of functional requirements when developing new materials. Each step, from synthesis through formulation and film processing, impacts the quality and reliability of the finished product. Typically, pattern-cured formulations consist of functionally different source materials which are employed to match pre-set goals for optical, mechanical, thermal and electrical film properties. However, source materials may contribute ionic and other impurities, either resulting from their respective synthesis, or generated as processing by-products. These impurities can pose a corrosion risk following migration to susceptible metal surfaces with which the film is in contact.
The goal of this work is to identify and understand corrosion risks presented by mobile ion impurities as a function of bulk film thermo-mechanical properties. For permanent films used in inkjet applications, key material properties include glass transition temperature (Tg), modulus and water permeability. Electrochemical Impedance Spectroscopy (EIS) was used along with Dynamic Mechanical Analysis (DMA), to characterize prototype films. The level of corrosive species present was analytically quantified via Inductively Coupled Plasma Mass Spectrometry (ICP-MS). Our data shows that thermo-mechanical properties of fully cured permanent film have significant impact on preventing corrosion with significant amounts of corrosive species present.
Document Type: Research Article
Publication date: January 1, 2010
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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