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Inkjet Printing and Argon Plasma Sintering of an Electrode Pattern on Polymer Substrates Using Silver Nanoparticle Ink

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Inkjet printing and plasma sintering of a silver electrode pattern on polymer substrates for applications in microfluidic systems is presented. The pattern consists of several finger electrodes and contact pads that exhibit lateral dimensions of 30 × 80 mm2. The pitch between neighboring finger electrodes is 270 μm and the smallest linewidth of the finger electrodes realized is 90 μm. Commercially available silver nanoparticle dispersion is used as ink. The electrode layout is printed onto a cyclic olefin polymer (COP) substrate. Prior to printing the substrate is activated using argon plasma in order to ensure good wetting. The as-printed features are then sintered using argon plasma. This sintering technique enables sintering of the nanoparticles in a selective manner without heating the substrate above its glass transition temperature. Sintering times are in the range of 5 to 15 minutes and the resulting resistivity of the printed features is approximately 57 times the bulk silver value.

Document Type: Research Article

Publication date: 2010-01-01

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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