Using Conductive Thermal Transfer Ribbons for Printed Electronics
IIMAK has developed conductive ribbons based on metal nano-particles (silver, silver / copper composites) and on vapor deposited metals (aluminum, copper) that provide the potential to print flexible circuits, membrane key boards, RFID antennas, etc. on a number of substrates (paper, vinyl, polypropylene, polycarbonate, polyimide, etc.). Dielectric ribbons based on insulating polymers are also available and can be used to provide insulating layers between conductive layers. Characteristics of the ribbons, prints and some model applications will be discussed along with the benefits and limitations of thermal transfer.
Potential to adapt these ribbons to the closely related technology of laser thermal transfer will also be discussed.
Document Type: Research Article
Publication date: 2009-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.
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