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Sintering Methods for Metal Nanoparticle Inks on Flexible Substrates

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In this paper a number of selective sintering methods suitable for inkjet printed nanoparticles are demonstrated on two different coated papers. The selective methods demonstrated here are electric current heating, microwave sintering and photonic curing. As a reference, conventional heat chamber sintering is also included. Conductivity measurements and studies of sintered structures with optical and scanning electron microscopy are performed, as well as a qualitative evaluation of how the heat-sensitive substrates are affected. The purpose is to analyze characteristics of each method and gain insight in how different process parameters affect overall performance and reliability. With heat chamber sintering the best achievable conductivity without substrate deformation corresponded to less than 20% of pure silver. With some selective methods, conductivity reached well above 50% of pure silver.

Document Type: Research Article

Publication date: January 1, 2009

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  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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