Sintering Methods for Metal Nanoparticle Inks on Flexible Substrates
Abstract:In this paper a number of selective sintering methods suitable for inkjet printed nanoparticles are demonstrated on two different coated papers. The selective methods demonstrated here are electric current heating, microwave sintering and photonic curing. As a reference, conventional heat chamber sintering is also included. Conductivity measurements and studies of sintered structures with optical and scanning electron microscopy are performed, as well as a qualitative evaluation of how the heat-sensitive substrates are affected. The purpose is to analyze characteristics of each method and gain insight in how different process parameters affect overall performance and reliability. With heat chamber sintering the best achievable conductivity without substrate deformation corresponded to less than 20% of pure silver. With some selective methods, conductivity reached well above 50% of pure silver.
Document Type: Research Article
Publication date: 2009-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
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