Dynamic Correction of Interconnections in Printed Electronics Manufacturing
Abstract:This paper studies the problem of automatically aligning the interconnections of integrated components in printed electronics modules. During the process, molding material is deformed and the components get displaced. Unless this is compensated on a per-module basis, the ink jetted connectors do not reach their targets. In this paper we propose a new connection redrawing method that applies a smooth displacement function to each pixel of the bitmap. Experiments show that using the new method, deformations are smoother, and the original shapes and intended electrical behavior are better preserved.
Document Type: Research Article
Publication date: January 1, 2009
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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