Dynamic Correction of Interconnections in Printed Electronics Manufacturing
Abstract:This paper studies the problem of automatically aligning the interconnections of integrated components in printed electronics modules. During the process, molding material is deformed and the components get displaced. Unless this is compensated on a per-module basis, the ink jetted connectors do not reach their targets. In this paper we propose a new connection redrawing method that applies a smooth displacement function to each pixel of the bitmap. Experiments show that using the new method, deformations are smoother, and the original shapes and intended electrical behavior are better preserved.
Document Type: Research Article
Publication date: 2009-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
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