Advances in Dryfilm Photoresist for Microfluidic Device Applications
Abstract:A novel approach to form a 3 dimensional microfluidic device is demonstrated by the use of a customized negative dryfilm photoresist. The formation of the microfluidic chambers utilizes a lamination process, which enables the tenting of a negative photoresist onto the thickfilm barrier layer. Specifically in this paper, we will discuss the influences of the dryfilm photoresist components and how they relate to thermo-mechanical and adhesive properties required to form a microfluidic chamber.
Document Type: Research Article
Publication date: 2009-01-01
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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