Using Hotmelt-Inkjet as a structuring method for higher efficiency industrial silicon solar cells
Continuous fine line openings below 20 μm width in the mask were obtained, which allowed for wet chemical etching of the underlying anti-reflective coatings. Subsequently nickel and Silver plating were used to form ohmic contacts, leading to a width of the metallization of down to about 30 μm. The results were achieved on micro-structured silicon surfaces covered by a silicon nitride layer commonly used in the photovoltaic industry.
Document Type: Research Article
Publication date: 2008-01-01
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