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Using Hotmelt-Inkjet as a structuring method for higher efficiency industrial silicon solar cells

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A procedure was developed to form openings in dielectric layers for subsequent contact formation based on inkjetting hydrocarbon wax. Basic investigations on the process focussing on obtaining the minimal feature size are presented.

Continuous fine line openings below 20 μm width in the mask were obtained, which allowed for wet chemical etching of the underlying anti-reflective coatings. Subsequently nickel and Silver plating were used to form ohmic contacts, leading to a width of the metallization of down to about 30 μm. The results were achieved on micro-structured silicon surfaces covered by a silicon nitride layer commonly used in the photovoltaic industry.

Document Type: Research Article

Publication date: 2008-01-01

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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