Coating Formulations for Digital Printing; Applications of Phase-Change Inks

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Hot melt/phase-change inks have gained popularity by imparting high print quality. As hot melt inks differ from other digital and conventional inks in terms of properties and mechanisms of transfer onto a substrate, there is need for developing low cost substrates compatible with these solid inks. As these inks solidify upon contact with the substrate, there is little absorption of the ink into the substrate. Thus, the print quality and associated color gamut are less sensitive to the substrate than that for aqueous ink jet printers.

It is well known that the surface properties that influence the print quality vary for different printing processes. Thus, the substrate-ink interactions must be well understood. Some of the important surface properties of a substrate include permeability, porosity, surface energy, roughness, opacity, brightness and gloss. These properties are known to influence final print quality and color gamut. Adhesion of ink on paper also plays a vital role. In addition, economics play a vital role. The paper specially formulated for phase-change inks sells for about 50 ¢ per sheet in comparison to 2-5 ¢ per sheet for water-based inkjet papers. Thus, there is a need for the development of lower cost substrates compatible with solid inks.

Document Type: Research Article

Publication date: January 1, 2008

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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