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Direct patterning by NanoPaste® and its application

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Direct patterning of NanoPaste® is a smart process for environment compared with conventional method like photography. Total process is simplified and the waste stemming from etching and cleansing steps is eliminated. The fine conductive pattern was demonstrated on various substrates. The thermal behavior of silver nanoparticles was investigated. Nanoparticle of 5nm in diameter can be sintered at temperature much lower than silver melting point to form a bulk metallic structure. Patterns with 70μm L/S were obtained by piezo type ink-jet printer. The sintering process has newly developed for copper NanoPaste® and copper circuit patterning was achieved by ink-jet printing. The fabrication of SiP is described. Super ink-jet technology provides the ultra-fine patterning with several micrometer rules and produces micro-bumps that are three dimensional structures. NanoPaste® is demonstrated to be a promising candidate for alternative material to the conventional plated silver. Sintered layer of silver NanoPaste® shows high bonding strength equivalent to the value for the silver plated surface in the ultrasonic bonding.
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Document Type: Research Article

Publication date: 2008-01-01

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  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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