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Direct patterning by NanoPaste® and its application

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Direct patterning of NanoPaste® is a smart process for environment compared with conventional method like photography. Total process is simplified and the waste stemming from etching and cleansing steps is eliminated. The fine conductive pattern was demonstrated on various substrates. The thermal behavior of silver nanoparticles was investigated. Nanoparticle of 5nm in diameter can be sintered at temperature much lower than silver melting point to form a bulk metallic structure. Patterns with 70μm L/S were obtained by piezo type ink-jet printer. The sintering process has newly developed for copper NanoPaste® and copper circuit patterning was achieved by ink-jet printing. The fabrication of SiP is described. Super ink-jet technology provides the ultra-fine patterning with several micrometer rules and produces micro-bumps that are three dimensional structures. NanoPaste® is demonstrated to be a promising candidate for alternative material to the conventional plated silver. Sintered layer of silver NanoPaste® shows high bonding strength equivalent to the value for the silver plated surface in the ultrasonic bonding.

Document Type: Research Article

Publication date: January 1, 2008

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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