UV curable jet-inks for etch resist applications
Abstract:Ink-jet printing of electronic devices such as photo-voltaics and circuit boards is attractive for a variety of reasons. This includes simplification of the manufacturing process, customization of design and the production of higher resolution prints. Additionally, the non-contact nature of ink-jet printing allows a wide range of media to be used, such as flexible plastics and silicon wafers.
This paper focuses on one class of fluid used in the circuit fabrication process, etch resistant inks. Here, the inks act as temporary masks where they must resist acid but remove readily in alkali, as well as offering mechanical robustness. However, it is difficult for most classes of jet-inks to satisfy these demands, whilst offering reliable jetting, fast dry times and appropriate droplet spread.
Here we show that UV curable formulations can be developed which offer these desirable properties. A discussion is given on how variations of the backbone chemistry, in terms of functionality and cure response, can have a dramatic effect in these properties. By incorporating a surface pre-treatment, we show that it is possible to fine tune the ink spread to give desirable print quality.
Document Type: Research Article
Publication date: January 1, 2008
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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