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Temperature-Dependent Reliability of Inkjet-Printed Structures in Constant-Humidity Environment

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Abstract:

Inkjet technology has shortened the processing time for current electronic components and minimizes material waste during their manufacture. Inkjet-printed nano silver ink IC interconnections are presented, but their reliability at varying temperatures as well as the evaluation of their reliability after humidity tests is not exhaustively explored. In this paper, we investigated the reliability of inkjet-printed interconnections from a variable environmental point of view. We tested nano silver inkjet-printed interconnections at 85°C in 85% RH for 1,000 hours for humidity evaluation and for 1,000 cycles from −40°C to 125°C to investigate temperature-cycling-based failures in combination with JEDEC Test Standards. Greek cross-structure, which is commonly used in the semiconductor industry, was used to evaluate fluctuation of the conductivity value after variable environment conditions. On the basis of the measurements obtained, we related electrical values before and after the tests using the Greek cross-structure. Also, the printing resolution of the inkjet-printed structures and the effect of these structures on the environmental reliability in the mentioned test runs were evaluated. The results of the temperature cycling test and of the humidity test show that the inkjet-printed silver structures have a good degree of reliability.

Document Type: Research Article

Publication date: January 1, 2008

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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