Second Transfer Process Simulation II
Abstract:In the second transfer process, electrostatic forces, caused by the transfer electric field, act on a sheet in the nipped region. As a result, the sheet sticks to the roller, and sheet transportation fails. We have developed a numerical simulation method of sheet transportation in the second transfer process. The method calculates sheet transportation by means of weak-coupling between electric field analysis and structural analysis, and which considers electrostatic forces acting on the sheet and displacement of components relative to each other. We used the method to calculate sheet transportation in a system that consists of two rollers and the sheet between them. In this system, the sheet passes between two rollers which contact each other and to which a voltage is applied. The calculated charge density and sheet displacement showed good agreement with experiments. Another analysis clarified the relationship between electric discharges in the nipped region and sheet sticking to the roller.
Document Type: Research Article
Publication date: 2008-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
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