Cross-Linked Naphthalene Bisimide “E-Barrier” Layer Compositions Using Blocked Isocyanate Chemistry
Managing hole injection from the conductive substrate is critical to prevent “background and breakdown spots” on the final prints. Typical solutions require a hole-injection barrier layer. These layers need to be environmentally insensitive, resistant to the charge generation layer coating solutions, while allowing transport of photogenerated electrons to the conductive layer to prevent cycling charge buildup.
This work describes the development of naphthalene bisimide hole-injection e-barrier layer compositions that can be both coated thick and uniform, and thermally cross-linked. These coating solutions are very stable at normal coating temperature and suitable for the dip coating process. The blocked isocyanate cross-linkers are activated after coating at a temperature above 120 °C. We have developed an offline method to study the kinetics of the cross-linking reaction using the GC headspace analysis technique for optimizing the crosslinked network.
Document Type: Research Article
Publication date: 2008-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
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