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Cross-Linked Naphthalene Bisimide “E-Barrier” Layer Compositions Using Blocked Isocyanate Chemistry

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High-quality electrophotographic applications demand a photoreceptor drum that is “perfect” in many aspects, such as being defect-free—almost to the submicrometer level—environmentally insensitive, and possessing a welldefined photosensitivity that matches the electrophotographic rendering process.

Managing hole injection from the conductive substrate is critical to prevent “background and breakdown spots” on the final prints. Typical solutions require a hole-injection barrier layer. These layers need to be environmentally insensitive, resistant to the charge generation layer coating solutions, while allowing transport of photogenerated electrons to the conductive layer to prevent cycling charge buildup.

This work describes the development of naphthalene bisimide hole-injection e-barrier layer compositions that can be both coated thick and uniform, and thermally cross-linked. These coating solutions are very stable at normal coating temperature and suitable for the dip coating process. The blocked isocyanate cross-linkers are activated after coating at a temperature above 120 °C. We have developed an offline method to study the kinetics of the cross-linking reaction using the GC headspace analysis technique for optimizing the crosslinked network.

Document Type: Research Article

Publication date: January 1, 2008

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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