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An Analysis on both Voltage Sensitivity and High Spatial Resolution with a New Electrostatic Voltmeter Having Extremely High Input Impedance

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We investigated the voltage sensitivity and spatial resolution of an electrostatic voltmeter with a high input impedance of 1016 Ω or higher, which was called HZ-ESVM, applied for measuring the electrostatic latent images on a photoconductor in an electro photographic printing system. We report the simulated and experimental results of the output voltage of the HZ-ESVM as a function of probe distance (gap) from the surface of the sample under test, and experimental results of spatial resolution.

In the simulated results, the simulated output ratio of the voltage between the measurement electrode the sample under test could keep the value higher than 80% at a gap of 50 μm by using a probe with the protruded length of the measurement electrode L = 100 μm. Moreover, the simulated output voltage against sample voltage achieved 95% output at a gap distance of 50 μm using a probe with a shorter length of L = 10 μm. In the experimental results, the HZ-ESVM with a probe of L = 0.32 mm and a measurement electrode diameter of 0.55 mm could measure 100% of the input voltage of 600 V up to a gap distance of 65 μm. It is revealed that the voltage without physical contact between the measurement electrode and the sample under test can be measured with this proposed method.

Document Type: Research Article

Publication date: January 1, 2008

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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