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Epitaxial film bonding technology for integrating dissimilar device materials

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We have developed “epitaxial-film-bonding (EFB)” technology for integrating light emitting diodes (LEDs) and integrated circuit (IC) drivers. This study is focused on testing the EFB technology to fabricate two-dimensional thin film LED arrays on substrates of various materials. Transferring the thin film LED device structure that were formed on the GaAs substrates to the other substrates was tested. All the thin film LED arrays tested in this study show good performance. The EFB technology will provide new “Digital Fabrication” process for integrating dissimilar materials.

Document Type: Research Article

Publication date: 2007-01-01

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  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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