Inkjet Patterning of UV Curable Etching Resist for Flexible Conductive Circuit Electrodes
Abstract:This paper discloses the recent evolution of flexible substrates with conductive film patterns by use of inkjet patterning of UV curable resist, etching process, and then striping the resist film in sequence. The UV curable ink has a viscosity of about 8∼20cps and surface tension of 30∼40 dyne/cm at operation temperature, which is appropriate for the inkjet printing process conducted on the ink at an elevated temperature. Experimental results indicated that the single drop size on the conductive film is about 75∼80μm. For the continuous line pattern, the minimum line width and line spacing of the printed resist can reach from 80 μm/60 μm to 80 μm/20 μm, and the resist thin film thickness is 5μm. After the etching and striping process, the conductive line width and line spacing can be 80 μm/20 μm. This low-cost and easy process is potentially promising to flexible electronics in the future.
Document Type: Research Article
Publication date: 2007-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
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