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Inkjet Patterning of UV Curable Etching Resist for Flexible Conductive Circuit Electrodes

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Abstract:

This paper discloses the recent evolution of flexible substrates with conductive film patterns by use of inkjet patterning of UV curable resist, etching process, and then striping the resist film in sequence. The UV curable ink has a viscosity of about 8∼20cps and surface tension of 30∼40 dyne/cm at operation temperature, which is appropriate for the inkjet printing process conducted on the ink at an elevated temperature. Experimental results indicated that the single drop size on the conductive film is about 75∼80μm. For the continuous line pattern, the minimum line width and line spacing of the printed resist can reach from 80 μm/60 μm to 80 μm/20 μm, and the resist thin film thickness is 5μm. After the etching and striping process, the conductive line width and line spacing can be 80 μm/20 μm. This low-cost and easy process is potentially promising to flexible electronics in the future.

Document Type: Research Article

Publication date: January 1, 2007

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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