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Inkjet Printing of Metal-Dielectric Crossovers

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In recent years, there has been significant interest in the inkjet printing of electronics circuits and devices. The inkjet deposition of a single functional material on a substrate is well developed, however little attention has been paid to the sequential printing of different functional elements to generate 3D structures such as crossovers and interconnections, the passive elements in electronics. Here we discuss the issues to be addressed in the optimization process in all inkjet printing of metal/dielectric/metal interconnects and crossovers. We describe the inkjet printing of a commercial silver nanoparticle conductor on glass and onto dielectric films of various thicknesses, and discuss issues to be considered when printing multilayer interconnects and crossovers with especially emphasis on printing across interfaces and onto surfaces of different composition.

Document Type: Research Article

Publication date: 2007-01-01

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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