Skip to main content

Inkjet-Deposited Interconnections for Electronic Packaging

Buy Article:

$12.00 plus tax (Refund Policy)

Inkjet technology provides an interesting approach for electronic manufacturing. Small volumes of functional material e.g., conductive ink are dispensed on top of the substrate. Electrical circuits are formed by suitable printing sequence and sintering processes. In this paper, we present a concept of inkjet deposited System-in-Package (SiP). The package contains bare ICs and discrete passive components that are encapsulated with resin mold. Encapsulation material works as a substrate for interconnections, which are directly deposited on top of the mold. All connections between the components and connections to the I/O pins are formed by inkjetting silver nano-particle and dielectric inks. Silver nano-particles are sintered in an oven at 220°C and resistivity values lower than 5 μΩcm are reported. Precuring of a substrate in a higher temperature than the sintering temperature of silver nano-particles, decreases the resistivity of the lines. As a conclusion, the sintering profile needs to be considered carefully in order to achieve resistance requirements set by the design. This paper focuses on interconnections and system integration design aspects.
No Reference information available - sign in for access.
No Citation information available - sign in for access.
No Supplementary Data.
No Data/Media
No Metrics

Document Type: Research Article

Publication date: 2007-01-01

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

  • Information for Authors
  • Submit a Paper
  • Subscribe to this Title
  • Membership Information
  • Terms & Conditions
  • Ingenta Connect is not responsible for the content or availability of external websites
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more