Skip to main content

Preparation of TiO2 on Ti-wires, or Fixation of Powdered TiO2 onto Wires of Heating Element for Decomposition of Organic Wastes by Thermally-generated Holes at High Temperatures in TiO2

Buy Article:

$20.00 plus tax (Refund Policy)


Titanium dioxide was once extensively investigated as a photoconductor for the electrophotographic photoreceptor at its incunabula. Nowadays, it has attracted attention as a material for photocatalyzers, solar cells as well as their related areas. We report here another application of titanium dioxide. We are so far involved in complete decomposition of organic wastes in air by thermally-generated holes in titanium dioxide of the powdered form. In view of the practical use of the present system, fixation of TiO2 powders onto a support in the form of, for example, a honeycomb seems to be the core technology. To realize this, we have tried in the present investigation to coat heating elements (Ti, Ni-Cr etc.) with TiO2 powders by means of electrophoretic deposition, or to directly oxidize Ti-coated alumina ball by wet hydrogen at 980 °C. Both methods are found to be effective. Then, we have carried out decomposition experiments, with the TiO2-coated wires or balls, of polycarbonate as well as benzene and toluene. We have confirmed that these compounds have completely been decomposed into H2O and CO2 by means of thermally-generated holes.

Document Type: Research Article

Publication date: January 1, 2007

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

  • Information for Authors
  • Submit a Paper
  • Subscribe to this Title
  • Membership Information
  • Terms & Conditions
  • ingentaconnect is not responsible for the content or availability of external websites

Access Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content
Cookie Policy
Cookie Policy
ingentaconnect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more